Packaging R&D Engineering Intern
Intel Corporation, Greater Phoenix metro area, Arizona
Description
In this position, you will primarily own
mechanical drawings for Intel?s electronic
packages. This position will require extensive
collaboration with assembly and test process
development teams, package design teams,
thermo-mechanical enabling design teams, as well as technical marketing teams.
As part of package drawings' requirement
gathering/definition, you will also be expected
to do package fit studies, complex tolerance
analysis as needed. Other responsibilities
include drawings' parameter validation by data
collection. You will be expected to proactively
identify and resolve any fit/tolerance issues,
assess project risks and provide mitigation
plans, drive performance against schedule,
clearly communicate project status, and conduct detailed drawing reviews.
Your responsibilities will include but not be limited to:
- Creating package 3D models and associated 2D package mechanical drawings
- Working with key partners to comprehend drawings' requirement
- Comprehensive design fit study and tolerance analysis
- Working with internal and/or external process development teams
- Acting as the single point of contact for package drawings for all teams.
- Directing design tradeoffs and driving decision
making in a dynamic, cross functional, team oriented environment
The ideal candidate should exhibit the following behavioral traits:
- Demonstrated excellent analytical skills
- Ability to manage and execute multiple projects
- Good communication skills
- Proficiency to balance technical and business related concerns
Qualifications
Minimum Qualifications
- Must be pursuing a MS or PhD degree in Mechanical Engineering.
- Minimum of 3 months experience with:
· SolidWorks
· Geometric Dimensioning and Tolerancing
Preferred Qualifications
- Experience with:
· Reliability, thermal, electrical and
mechanical aspects of packaging, assembly process
and/or manufacturing and cost.
· PCB/package design tools (Xpedition from Mentor Graphics)
· Physical design
If interested in the summer internship, please
contact karthik.manohar<at>intel.com
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Potential applicants should communicate directly
with the contact listed in the posting. Please
do not "reply" to the posting messages.
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Received on 2016-03-07 15:38:09